I have an idea: first, an open-design concept; second, a water-cooling system design! When we were kids, we all watched Transformers and even bought Transformer toys. Now, space stations are getting closer to us every day. Think of Poseidon, think of energy crystals—suddenly, inspiration strikes! But…

Although the water-cooling system makes our equipment less sensitive to heat, with an open design, what about dust? My closed-case PC accumulates a fair amount of dust every two years!!!         

        Energy crystals, inverted placement, and levitation. If we can achieve these three features, wouldn’t that solve the problems of cool aesthetics, dust, and even the challenges of working in space? So my initial concept is taking shape—now, how do we turn it into reality?

First, the entire structure takes on a diamond shape, symbolizing the energy crystal.

Second, the motherboard is positioned at the top, with a flip-over design. This not only addresses the dust issue but also ensures that dust cannot settle directly on the front side of the motherboard.

Third, the top panel is separated from the main body. This dual approach allows for an open design while fully showcasing the synchronized lighting effects of the CPU, graphics card, fans, and other components—and it even creates a levitating effect, making the whole setup look like a UFO: mysterious and sci-fi.

        Here are some specific details:

For example, on the back side, where the CPU water-cooling radiator is mounted, we’ve added a dedicated stand column. This both supports the top panel and helps conceal the structure, enhancing the levitation effect.

Another example: at both ends of the main body, we’ve installed case fans. These not only improve internal cooling but also create a “UFO engine” effect.

And then there’s the question of how to disassemble and reassemble the top panel, main body, and stand columns—so that the design can be 3D-printed on various small form-factor platforms while still maintaining sufficient structural strength after assembly.        

        The overall chassis layout includes space for the motherboard, power supply, CPU, graphics card, water-cooling system, memory, M.2 SSDs, traditional mechanical hard drives, and two case fans. Specifically, if the water-cooling system uses three fans, the stand columns should be designed with about 30 mm of clearance to ensure adequate vertical space; additionally, the graphics card mount should include an extra 15 mm shim to accommodate the available space.

        Special note: the modular printing settings for the chassis have been optimized. We recommend using PETG material for long-term durability. For assembly, leave a 0.2 mm gap between parts to allow for minor adjustments due to printing tolerances. If necessary, gently heat and press the mating components and connectors, and use a small knife to make fine tweaks—but avoid overdoing it, as this could compromise the structural integrity. After several insertions and extractions, verify that the thermal-melt nuts are securely seated; once confirmed, apply a small amount of adhesive to lock everything in place. As for the case fans, you can simply screw them directly into the chassis using wood screws. The motherboard requires six M3×10×5 thermal-melt nuts. When installing the stand columns, be sure to protect any sensitive electronic components. Bill of Materials Motherboard installation requires pre-embedded M3×10×5 thermal-melt nuts × 6