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ESP32-S3 case with heat sinks and exposed USB pins
Print Profile(1)
  • 0.08 mm layer height, 2-wall structure, 15% infill density

    1-disc

    PLA

    Designer

2

2

26

10

Released 2026-03-26
Details
Files(2)
Makes & Comments (0)

ESP32-S3 case with heat sinks and exposed USB pins

Originality of the Model

The author declares that this work is their personally original model

This model is licensed under the following terms:

Credit must be given to the creator

Models(2)

  • model file image
    esp32s3带散热孔usb引脚外露外壳.3mfDesigner

    49.81 KB

    2026-03-26

  • model file image
    esp32s3带散热孔usb引脚外露外壳.stlDesigner

    93.34 KB

    2026-03-26

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