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  • Chassis

  • Heat Dissipation

  • Computer Case

  • Small host

NSY heat-dissipation-enhanced enclosure
Print Profile(1)
  • 0.08 mm layer height, 2-wall structure, 15% infill density

    2-disc

    PLA

    Designer

0

0

3

1

Released 2026-03-24
Details
Files(2)
Makes & Comments (0)

NSY heat-dissipation-enhanced enclosure, compatible with the NSY mini PC motherboard

Originality of the Model

The author declares that this work is their personally original model

This model is licensed under the following terms:

Credit must be given to the creator

Models(2)

  • model file image
    nsy散热增强外壳.3mfDesigner

    126.01 KB

    2026-03-24

  • model file image
    nsy散热增强外壳.stlDesigner

    201.84 KB

    2026-03-24

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