This 3D-printed front-mounted heat‑dissipation guide plate, specially designed for the “Ji Kongjian” series of devices, is engineered to optimize the device’s air intake architecture and significantly enhance thermal performance. Crafted in a sleek black finish, the plate features a robust panel equipped with dense longitudinal cooling fins and strategically placed lateral airflow channels—perfect for accommodating standard‑size cooling fans. Multiple mounting holes are arranged along both sides, complemented by dedicated locating pins and support feet that ensure precise, secure attachment to the device’s enclosure. The guide plate efficiently directs external cool air to flow rapidly and uniformly through the device’s heat‑generating components, effectively reducing operating temperatures across critical hardware.

Design Highlights

• High‑Flow Cooling Grille

  The meticulously engineered longitudinal grille, combined with horizontal vent slots, forms an ultra‑efficient airflow path that dramatically reduces air resistance while boosting air volume per unit of time.

• Modular Fan Mounting Design

  A dedicated fan mounting slot is pre‑installed in the center, allowing users to easily add either a 12cm or 14cm case fan based on their specific cooling requirements, enabling a straightforward upgrade to active cooling solutions.

• Stable, Precise Mounting System

  Multiple mounting holes on both sides, paired with specialized cylindrical locating pins, ensure seamless and rock‑solid integration with the device’s enclosure, minimizing resonance and noise during operation.

• Plug‑and‑Play Compatibility

  Specially tailored to fit the front panel design of “Ji Kongjian” devices, this guide plate requires no additional modifications. Once installed, it seamlessly aligns with existing ports and indicator lights, preserving the device’s clean and uncluttered aesthetic.

Technical Specifications

• Compatible Devices: Ji Kongjian series NAS units or servers
• Optional Fan Installation: Standard 12cm or 14cm case fans
• Recommended Materials: High‑strength PLA or PETG (we recommend using the PLA/PET materials highlighted in the diagram)
• Mounting Method: Securely fastened via locating pins and the device’s original screw holes
• Print Platform Recommendation: For optimal bed adhesion and surface quality, we suggest using the high‑tack “Cool Plate (SuperTack)” platform shown in the diagram

Application Scenarios

▸ Enhancing active cooling for Ji Kongjian NAS devices under heavy workloads

▸ Improving the operating environment of devices housed in high‑temperature data centers or weak current cabinets

▸ Enabling DIY enthusiasts to implement silent operation or high‑performance thermal upgrades for storage servers

▸ Applications requiring long‑term low‑temperature maintenance to extend hard drive lifespan