Heat Dissipation
a1mini
Power Supply Cooling
- 0.2 mm layer height, 3‑layer walls, 15% infill density
1-disc
PLA
Designer
6
0
To dissipate heat from the printer, the A1mini shown in the image is mounted above the power supply compartment, providing simultaneous cooling for both the power supply and the motherboard while preventing direct airflow onto the heated bed. This setup requires a 4010 axial fan, powered by 24V from AMS.
Originality of the Model
The author declares that this work is their personally original model
This model is licensed under the following terms:
This work is licensed under a Standard Digital File License. Digital files have a strict non-commercial, personal use only license.
You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital file or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including remixes of this object). You can not host these files on other digital platforms, web stores or cloud repositories. The objects may not be used in any way whatsoever in which you charge money, collect fees.
Models(1)
- 涡扇外壳.3mfDesigner
32.40 KB
2026-02-13
